MFE Bottom Plate Scanning is the process of using a magnetic field to detect changes in material thickness. The scanner is rolled over a plate and a read out tells the technician if the plate has gotten thinner. The tech ‘proves up’ these indications with ultrasonics to the depth of the pitting on the underside of the plate, or role it out as a false indication.


  • Very sensitive
  • Can detect changes in thicknesses as low as 0.010″


  • No way to differentiate between topside pitting and underside pitting.